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RGT Technology, LLC . . .
Part Number | Manufacturer | Description | Brand | Price & Lead Time |
---|---|---|---|---|
H-2303-03-9017-05-A | EMULATION TECHNOLOGY | Heat Sink; Package/Case:Ball Grid Array; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 Simple Type: Semiconductors | Request Quote | |
H-2503-01-9031-05-A | EMULATION TECHNOLOGY | Heat Sink; Package/Case:Ball Grid Array; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 Simple Type: Semiconductors | Request Quote | |
H-2703-05-9000-05-A | EMULATION TECHNOLOGY | Heat Sink; Package/Case:Ball Grid Array; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 Simple Type: Semiconductors | Request Quote | |
H-2705-05-9018-05-A | EMULATION TECHNOLOGY | CONNECTOR Simple Type: TBD | Request Quote | |
H-3503-07-9038-05-A | EMULATION TECHNOLOGY | Heat Sink; Package/Case:Ball Grid Array; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 Simple Type: Semiconductors | Request Quote | |
H-3753-07-9015-05-A | EMULATION TECHNOLOGY | Heat Sink; Package/Case:Ball Grid Array; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 Simple Type: Semiconductors | Request Quote | |
H-4003-07-9040-05-A | EMULATION TECHNOLOGY | Heat Sink; Package/Case:Ball Grid Array; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 Simple Type: Semiconductors | Request Quote | |
H-4253-09-9020-05-A | EMULATION TECHNOLOGY | Heat Sink; Package/Case:Ball Grid Array; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 Simple Type: Semiconductors | Request Quote | |
H-4503-07-9016-05-A | EMULATION TECHNOLOGY | Heat Sink; Package/Case:Ball Grid Array; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 Simple Type: Semiconductors | Request Quote | |
HEADER-MALE-32 | EMULATION TECHNOLOGY | Fasteners, Machine Screws Simple Type: Tools & Production Supplies | Request Quote |